A mobile chip expert shared the latest Weibo post, unveiling that Apple plans to launch two M3 series chips that utilize 3nm technology. These chips will build upon the existing M3, M3 Pro, and M3 Max chips.
The recent announcement has sparked speculation among various media outlets and users alike. Transitioning to the next point, we can reasonably assert that the M3 Ultra is positioning itself as the fourth piece in the series. Furthermore, it is anticipated to seamlessly integrate “UltraFusion” technology. Speculation surrounds the fifth chip in the Apple M3 series, with possibilities including the previously exposed Extreme version or potentially a shrunk Lite version.
In a subsequent Weibo post, the mobile chip expert mentioned that Apple’s current iPhone camera employs a combination of a Sony CIS sensor and Sony ISP. However, Apple is actively assessing its in-house developed ISP and anticipates commencing mass production through TSMC in the latter half of 2026.
According to the mobile chip expert, industry insiders in the field of mobile phone chips are confident that given Apple’s capabilities, designing its own ISP for image processing is well within reach. Stay tuned with us for more updates in the future.
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