Vivo is set to launch its highly anticipated Vivo X Flip phone soon, which is a vertical folding screen phone. The Vivo X Flip phone has been leaked multiple times recently. The latest official images of the phone were released by the company, showing the real machine for the first time.
X Flip Phone Configuration
According to the images, the X Flip features a large external screen, a circular camera module in the upper left corner, and a purple diamond grid pattern on the back cover. The phone has been experienced by actor Wang Ziwen, who has given it a thumbs up.
The X Flip is powered by Qualcomm’s Snapdragon 8+ Gen 1 chip and boasts 12GB of RAM. The phone has a reduced main frequency of 3.0GHz and comes pre-installed with the Android 13 system. It uses LPDDR5 memory and UFS 3.2 storage, making it lightweight and efficient.
The X Flip’s 6.8-inch FHD+ 120Hz OLED screen provides a high-quality display. It also boasts a 50MP (IMX866, some say it is IMX766, to be confirmed) main camera and a 12MP (IMX663) ultra-wide-angle camera, ensuring high-quality images and videos can be captured.
X Flip also has side fingerprint recognition and a square secondary screen. At the same time, it also has a built-in 4400mAh battery that supports 44W fast charging. It also features stereo speakers and two microphones, making it ideal for multimedia use.
The phone is expected to be released in April, although an exact date has not yet been confirmed.
The design of the X Flip has generated mixed reactions from tech enthusiasts and consumers alike. Some have praised its innovative folding screen design and sleek appearance. At the same time, others have criticized its lack of screen fingerprint recognition and raised concerns about the durability of the folding screen.
Despite these concerns, the X Flip is expected to be a major competitor in the increasingly crowded folding phone market. With its advanced features and cutting-edge technology, it is sure to appeal to tech-savvy consumers looking for the latest and greatest in mobile technology.