The latest flagship series, Redmi K70, is set to be unveiled by the official Redmi account on the 29th of this month. As the release date approaches, the official channel has initiated the pre-launch activities. On November 23rd, Phone China observed Lu Weibing announcing the integration of a new cooling system called Ice Seal Cooling for the Redmi K70 Pro.
This system adopts a globally planned cooling solution, featuring a self-developed next-generation cooling material, challenging the limits of passive cooling. Lu Weibing also stated today that the Redmi K70 Pro achieves a comprehensive evolution in appearance, experience, screen, and imaging, establishing itself as a performance leader in the Redmi lineup.
The current official pre-launch information reveals that the Redmi K70 Pro features the third-generation Qualcomm Snapdragon 8 mobile platform, delivering powerful performance. Moreover, digital bloggers have leaked information suggesting that the Redmi K70 Pro has eliminated the 8GB RAM variant and starts directly from 12GB.
At the same time, the blogger also pointed out that, considering the pricing strategy of the K60 series last year, the company expects to set the starting price for this model at 3899 yuan (about $545). Many consider this pricing reasonable, considering the comprehensive upgrade without a cost increase, surpassing many other manufacturers. The official announcement has confirmed that the company will release the new device later this month.
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