The blogger @数码闲聊站 revealed today that the Xiaomi Civi 4 engineering phone uses the flagship platform of the Snapdragon 8 series, partnering with Leica for imaging. Additionally, it boasts a 1.5K 2.7D slightly curved dual-hole screen and integrates a metal middle frame.
The Xiaomi Civi 4 mobile phone is revealed to embrace the Snapdragon 8 series flagship platform, Leica co-branding, and a metal middle frame. another blogger @智慧皮卡丘 anticipates its release around May, highlighting a curved screen design. The phone’s positioning has been upgraded, aligning with the Honor digital series for benchmarks.
In addition, the phone will continue to launch co-branded gift boxes. As a reference, the previous-generation Xiaomi Civi 3 debuted in May last year. It featured the Dimensity 8200-Ultra processor, a 6.55-inch 2400×1080 OLED hyperbolic screen, a slim 71.7mm body, 7.56mm thickness, and a weight of 173.5g. The device housed a 4500mAh battery, and a plastic middle frame, and started for 2,499 yuan (about $347).
Currently, Xiaomi has not officially disclosed any information regarding the Civi 4 series of new phones. Ongoing attention will be given to providing follow-up reports on any developments. Stay tuned for more updates.
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