According to industry reports, Apple has taken a cue from AMD and commenced trial production of a small quantity of SoIC (System Integrated Chip) using TSMC’s latest 3D small chip stacking technology. The company aims to utilize TSMC’s SoIC with an InFO packaging solution, potentially for MacBook applications. As a result, consumers could experience the end product the fastest in 2025~2026.
AMD successfully adopted TSMC’s SoIC advanced packaging technology. Apple is reportedly conducting a small-scale trial production of the same technology.
As of July 31, the semiconductor industry faces a downturn. However, there is a notable surge in demand for high-performance AI chips for servers because of the rise of generative AI. As a result, TSMC has introduced a CoWoS advanced packaging production capacity expansion plan to accommodate customer needs.
Apple 3D Stacking TSMC’s SoIC is the first high-density 3D small chip stacking technology. Chip Wafer (CoW) packaging enables the heterogeneous integration of chips of different sizes, functions, and process nodes. AMD is the pioneer customer, utilizing the SoIC technology with CoWoS packaging for its newly launched MI300 series.
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Apple’s decision to adopt SoIC with InFO solutions is driven by comprehensive considerations encompassing product design, positioning, and cost. Successful integration into mass consumer electronics is expected to increase demand and capacity. This move may also encourage other significant customers to adopt the technology. TSMC’s SoIC technology is in its early stages, with a monthly production capacity of nearly 2,000 pieces, projected to double in the coming years.